发明名称 SUBSTRATE SUPPORT TABLE OF PLASMA PROCESSING DEVICE
摘要 <p>Provided is a substrate support table of a plasma processing device, which stably controls a substrate at a relatively high temperature.  The substrate support table comprises an electrostatic attraction plate (14) containing a first electrode for holding a substrate (W) by electrostatic attraction, a second electrode for applying a bias to the substrate (W), and a heater for heating the substrate, a cylindrical flange (13) welded to the lower surface of the electrostatic attraction plate (14) and produced from an alloy having the same heat characteristic as the electrostatic attraction plate (14), and a support table (10) comprising an O-ring (12) in a surface facing the lower surface of the flange (13), to which the flange (13) is attached via the O-ring (12), wherein when the bias power to be applied to the substrate (W) is changed, the heater power for heating the substrate (W) is changed so that the temperature of the substrate (W) is constant.</p>
申请公布号 WO2010095299(A1) 申请公布日期 2010.08.26
申请号 WO2009JP66065 申请日期 2009.09.15
申请人 MITSUBISHI HEAVY INDUSTRIES, LTD.;KAFUKU HIDETAKA;MATSUKURA AKIHIKO;YANAGIDA HISASHI 发明人 KAFUKU HIDETAKA;MATSUKURA AKIHIKO;YANAGIDA HISASHI
分类号 H01L21/683;C23C16/458;H01L21/205;H01L21/3065;H05H1/46 主分类号 H01L21/683
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