发明名称 APPARATUS FOR BONDING SUBSTRATE AND APPARATUS FOR FEEDING BUFFER FILM
摘要 PURPOSE: The substrate bonding equipment and shock-absorbing film supply device keep the tension of the shock-absorbing film with the torque motor. Shock-absorbing between pressor and the stage are proceed efficiently. CONSTITUTION: The substrates is arranged in the stage. Pressor adds pressure to substrate through the shock-absorbing film(210). The supply reel(230) supplies the shock-absorbing film between the stage and pressor. The return reel(250) collects the shock-absorbing film. The supporting part(220) supports the supply reel and return reel in order to be possible to rotate. Controller controls the rotation angle of the supply reel.
申请公布号 KR20100093844(A) 申请公布日期 2010.08.26
申请号 KR20090012955 申请日期 2009.02.17
申请人 LG DISPLAY CO., LTD. 发明人 KIM, SUNG HOON
分类号 H01L21/58;G02F1/1345;H01J9/24 主分类号 H01L21/58
代理机构 代理人
主权项
地址
您可能感兴趣的专利