发明名称 METHOD AND DEVICE FOR INSPECTING SOLID-STATE IMAGE SENSOR, AND METHOD OF MANUFACTURING SOLID-STATE IMAGE SENSOR
摘要 <P>PROBLEM TO BE SOLVED: To reduce a throughput required for inspecting a solid-state image sensor. <P>SOLUTION: The solid-state image sensor including: a pixel region consisting of a plurality of pixels arranged in two dimensions; and a vertical scanning circuit being arranged on one side in the line direction of the pixel region and supplying a plurality of the pixels with driving signals at every line is inspected. Signals from the pixels arranged in partial regions positioned on the reverse side to the vertical scanning circuit in the pixel region obtained under the state irradiating the solid-state image sensor with a light are stored. The stored signals are integrated extensively over only the partial regions at every line. The quality of the solid-state image sensor is decided on the basis of integrated values at every line obtained at the integrating stage. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010187232(A) 申请公布日期 2010.08.26
申请号 JP20090030399 申请日期 2009.02.12
申请人 NIKON CORP 发明人 KAWABATA SEIJI
分类号 G01R31/26;H01L21/66;H01L27/14;H04N5/335;H04N5/367;H04N5/374;H04N5/3745 主分类号 G01R31/26
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