| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device and a method for mounting an electronic component improving production efficiency by measuring the height of a board and that of the electronic component by one laser sensor. <P>SOLUTION: An operation of sucking a small electronic component B or the like by a transfer head 13a including a component suction nozzle 13d and a laser sensor 17 or the like as shown in Fig.1 and thereafter mounting the electronic component on a board A is carried out using a component management program including data related to the small electronic component B and the like and data of mounting height. In this method, the mounting height is determined from thickness data of the small electronic component B or the like, thereafter the surface height of the board A is measured by the laser sensor 17, and the mounting height of the small electronic component B or the like is corrected from the result thereof, and the thickness of the small electronic component B or the like detected by measuring the surface height of the small electronic component B or the like mounted on the board A by the laser sensor 17. <P>COPYRIGHT: (C)2010,JPO&INPIT |
