| 发明名称 |
ELECTRONIC COMPONENT MOUNTING STRUCTURE AND ELECTRONIC COMPONENT MOUNTING METHOD |
| 摘要 |
An electronic component mounting structure includes a first substrate on which a first component is mounted and a second substrate connected to the first substrate. The second substrate is bent toward the first component.
|
| 申请公布号 |
US2010214741(A1) |
申请公布日期 |
2010.08.26 |
| 申请号 |
US20090632398 |
申请日期 |
2009.12.07 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
TAKADA RIE;TSUBONE KENICHIRO |
| 分类号 |
H05K7/20;H05K1/00;H05K1/14;H05K3/30 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
