| 发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION AND CIRCUIT BOARD USING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an alkali developable photosensitive resin composition which does not produce byproduct resulting from a photo-base generator and requires no curing at a high temperature, unlike a conventional photosensitive resin composition, and to provide a circuit board using the composition. <P>SOLUTION: The photosensitive resin composition contains a photo-base generator (A) and a polyamide acid (B). The photo-base generator is a compound having an acyloxyimino group expressed by formula (1); and the polyamide acid is the one having a polymerizable group in the main chain and/or at the terminal. In formula (1), X<SP>1</SP>represents an arylene group having a linking group Y; n represents an integer of 0 to 3; R<SP>1</SP>represents an aromatic group or an alkyl group having the linking group Y; and Y is a divalent organic group. <P>COPYRIGHT: (C)2010,JPO&INPIT |
| 申请公布号 |
JP2010186134(A) |
申请公布日期 |
2010.08.26 |
| 申请号 |
JP20090031329 |
申请日期 |
2009.02.13 |
| 申请人 |
ASAHI KASEI E-MATERIALS CORP |
发明人 |
NAGASAWA TOSHIAKI;KATAYAMA YUJI |
| 分类号 |
G03F7/004;C08F299/02;C08G73/10;G03F7/027;G03F7/038;G03F7/40;H05K3/28 |
主分类号 |
G03F7/004 |
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