| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a tape carrier for semiconductor devices, which can achieve high reliability by suppressing a decrease in migration resistance between conductor patterns and electric short-circuiting, and to provide a method of manufacturing the same. <P>SOLUTION: The tape carrier for semiconductor devices is characterized in that a seed layer 2 has an external shape size smaller than the external shape size of a lower surface of a conductor pattern 3, a sidewall of the seed layer 2 is formed having an undercut structure which is a prescribed distance recessed on the undersurface of the conductor pattern 3 from the external shape of the conductor pattern 3, and a tin plating layer 4 covers a top surface of the conductor pattern 3 and the sidewall of the seed layer 2. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
