ADHESIVE COMPOSITION AND SEMICONDUCTOR WAFER-PROTECTIVE SHEET USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a sheet for forming a semiconductor wafer-protective film capable of forming the protective film excellent in flatness and rupture (or cutting) resistance, and to provide an adhesive composition capable of realizing such protective films and sheets. SOLUTION: The adhesive composition includes: (A) a phenoxy resin; (B) an epoxy resin; (C) an aminosiloxane with a weight-average molecular weight of 2,000 or lower; (D) an epoxy resin-curing catalyst; (E) an inorganic filler; and (F) a polar solvent with a boiling point of 80-180°C and a surface tension at 25°C of 20-30 dyne/cm; in predetermined amounts, respectively. COPYRIGHT: (C)2010,JPO&INPIT