发明名称 |
Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers |
摘要 |
An apparatus having a three-dimensional integrated circuit structure is described herein. The apparatus include an interposer for carrying a plurality of high and low-power chips. The high-power chips are attached and connected to one side of the interposer, while the low-power chips are attached and connected to the other side of the interposer. In generally, the high-power chips produce more heat than does the low-power chip during their operations. The interposer further include through silicon vias and redistribution layers for connecting the chips on both surfaces. In addition, the interposer assembly is attached and connected to a substrate layer, which is in turn attached and connected to a printed circuit board. In order to provide improve thermal management, the interposer surface carrying the high-power chips are oriented away from the circuit board. A heat spreader is attached to the back sides of the high-power chips for dissipating the heat.
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申请公布号 |
US2010213600(A1) |
申请公布日期 |
2010.08.26 |
申请号 |
US20100709291 |
申请日期 |
2010.02.19 |
申请人 |
THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY |
发明人 |
LAU HON SHING;LEE SHI-WEI;YUEN MATTHEW MING FAI;WU JINGSHEN;LO CHI CHUEN;FAN HAIBO;CHEN HAIBIN |
分类号 |
H01L23/34;H01L21/60;H01L23/498 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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