| 摘要 |
<p>Provided is a method for manufacturing a module with a built-in component, by which a hollow cavity for storing a circuit component without bringing the circuit component into contact with a resin layer can be formed, while reducing the thickness of the resin layer. An uncured first resin layer (10) having a penetrating opening section (11) is laminated on a cured second resin layer (20), a first circuit component (5) is mounted on a wiring pattern (2a) on a module substrate (1), and the first resin layer (10) is bonded with pressure and cured on the module substrate (1) so that the uncured first resin layer (10) faces the module substrate (1) and that the first circuit component (5) is stored in the opening section (11) without being brought into contact with the opening section. Since the second resin layer (20) does not deform, the first circuit component (5) can be arranged in the hollow cavity without being brought into contact with the hollow cavity.</p> |
