PACKAGE FOR SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To achieve height reduction without increasing external shape size.

SOLUTION: A lead 3 provided with first holes 5 formed so as to reach at least a resin molding formation-scheduled part 2 and second holes 6 formed outside the resin molding formation-scheduled part 2 is used to implant a resin through the first holes 5 from a parting line of the molding metal mold 7 where the lead frame 1 is pinched. Consequently, it is not necessary to form a gate recess at a package bottom part for a semiconductor device and a gate remainder 14 remains at a bent part of the lead frame 1, thereby achieving height reduction without increasing the external shape size.

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