| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin giving a cured article having heat resistance and high thermal conductivity, and an epoxy resin composition thereof. <P>SOLUTION: This epoxy resin composition for semiconductor sealing includes an epoxy resin having a specified phenol aralkyl resin structure, for example, represented by formula (1), a specified phenol aralkyl resin, and an inorganic filler. In the formula, a plurality of Rs each independently represents a hydrogen atom or a 1C-4C alkyl group, n is an average value which is 1<n≤4. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
