| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce stress applied to a sensing part and bump electrode of a sensor chip as much as possible in a sensor device composed by flip-chip mounting the sensor chip forming a polygonal planar shape having the sensing part on a substrate through an underfill resin. <P>SOLUTION: The sensor device is composed by loading the sensor chip 10 forming the polygonal plane shape having the sensing part 11 and having the bump electrode 12 on one surface on the substrate 20 through the underfill resin 30 and electrically bonding the bump electrode 12 and the substrate 20. The underfill resin 30 is provided on a part other than the bump electrode 12 and a part other than a corner on one surface of the sensor chip 10. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
