| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an efficient method of forming a wiring conductor which can meet such demands as thinning of line width and increase of line thickness. <P>SOLUTION: A metal film 3 is formed on a base 1, a trench 5 is formed in the base 1 by irradiating a femtosecond laser beam 4 having a pulse width of less than 1 picosecond from above the metal film 3, the trench 5 is filled with the metal composing the metal film 3 while melting that metal, and then the metal is cooled and solidified thus obtaining a wiring conductor 2 buried in the base 1. Thereafter, a step of removing the metal film 3 remaining on the surface of the base 1 excepting the trench 5 is carried out, as required. Preferably, the laser beam 4 is focused on the base 1, in the laser beam irradiation process. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
