METHOD FOR DIVIDING BRITTLE MATERIAL SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To inhibit generation of cracks at the intersecting point when a brittle material substrate is divided in mutually crossing two directions by using laser.

SOLUTION: A first scribe line 52a comprising a vertical crack 53a and a second scribe line 52b comprising a vertical crack 53b are formed by irradiation with laser beams LB and spray with a refrigerant from a cooling nozzle 37. Then the second scribe line 52b is irradiated again with the laser beams LB to grow the vertical crack 53b so as to divide the substrate 50 along the second scribe line 52b. Thereafter the first scribe line 52a is irradiated again with the laser beams LB to grow the vertical crack 53a so as to divide the substrate 50 along the first scribe line 52a. In this case when the first scribe line 52a is irradiated again, the maximum width of irradiated width in the irradiation spot of the laser beams LB is made 1.0 mm or less.

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