| 摘要 |
PROBLEM TO BE SOLVED: To prevent a sealing resin part 9 of a semiconductor device 8 from deteriorating in sealing performance owing to a gas discharged when the sealing resin part 9 is heated to be cured. SOLUTION: A flexible insulating tape 7 on which semiconductor devices 8 are mounted is conveyed in a predetermined direction N, a sealing resin part 9 of the semiconductor device 8 is heated, and a first exhaust pipe 30 which exhausts a gas discharged from the sealing resin part 9 during the heating to the outside is installed ahead of a position (a), where the amount of gas discharge from the sealing resin part 9 becomes maximum, in the conveyance direction N. The gas is reliably exhausted to prevent the sealing resin part 9 from deteriorating in sealing performance. COPYRIGHT: (C)2010,JPO&INPIT |
