发明名称 |
Moisture-proof device, moisture-proof IC, and method for increasing moisture-proof capability of IC |
摘要 |
Method for increasing the moisture-proof capability of a chip includes coating moisture-proof glue at the chink of the chip. More particularly, when the packaging structure carries a chink exposed to outside of the chip, the chink is coated with the moisture-proof glue for preventing moisture from entering the internal part of the chip so as to increase the moisture-proof capability of the chip.
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申请公布号 |
US2010213621(A1) |
申请公布日期 |
2010.08.26 |
申请号 |
US20100690902 |
申请日期 |
2010.01.20 |
申请人 |
SUN WEI-CHUNG;LIN CHIN-MING;CHEN WEI-JEN;WU CHIN-FENG |
发明人 |
SUN WEI-CHUNG;LIN CHIN-MING;CHEN WEI-JEN;WU CHIN-FENG |
分类号 |
H01L23/28;H01L21/56 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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