| 摘要 |
<p>Provided is a module with a built-in component, by which reliability of electrical connection between a wiring section of a resin substrate and a circuit component is improved and manufacturing process is simplified. A module (10) with a built-in component is provided with a circuit component (11) having first and second external electrodes (11A, 11B) on the both end portions; a nonphotosensitive resin layer (12) wherein the circuit component (11) is embedded so that at least a part of the first and the second external electrodes (11A, 11B) of the circuit component (11) is exposed; a photosensitive resin layer (13) formed on an upper surface of the nonphotosensitive resin layer (12); and first and second wiring sections (14, 15), which are formed to penetrate the photosensitive resin layer (13) and electrically connected to the first and the second external electrodes (11A, 11B) of the circuit component (11).</p> |
