| 摘要 |
PURPOSE: A vacuum reflow apparatus is provided to improve the junction performance of a soldering process by maintaining a nitrogen atmosphere or a formic-acid atmosphere inside a vacuum chamber. CONSTITUTION: A chamber unit(100) includes a chamber housing(120) and a heater. A chuck unit(200) includes a wafer chuck(210) and a shielding wall(220). The shielding wall hermetically closes the opening of the chamber unit, and the wafer chuck is placed inside the chamber unit. An actuator forwardly or backwardly moves the shielding wall. The chamber unit and the chuck unit are interlocked to each other. A vacuum generation unit generates vacuum in the chamber unit using a vacuum pump.
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