发明名称 BONDING METHOD AND BONDED BODY
摘要 <P>PROBLEM TO BE SOLVED: To provide a bonding method for mutually bonding two base materials through a bonding film inexpensively patterned into minute shapes and a bonded body equipped with the bonding film bonded by the bonding method. <P>SOLUTION: This bonding method includes: under the condition that the first base material 21 and the second base material 22 to be bonded together through the bonding film 3 are prepared, the process for forming liquid film patterned into the predetermined shape at least either on the first base material 21 or on the second base material 22 by supplying silicone material-containing liquid material with a liquid droplet delivering method; the process for obtaining the bonding film 3 patterned into the predetermined shape at least either on the first base material 21 or on the second base material 22 by drying the liquid film; and the process for obtaining the bonded body 1, in which the first base material 21 and the second base material 22 are bonded together through the bonding film 3 by making to appear the adhesion near the surface 32 of the bonding film 3 by giving energy to the bonding film 3. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010184500(A) 申请公布日期 2010.08.26
申请号 JP20100102354 申请日期 2010.04.27
申请人 SEIKO EPSON CORP 发明人 YAMAMOTO TAKATOMO;SATO MITSURU;ASUKE SHINTARO;MORI YOSHIAKI;GOMI KAZUHIRO
分类号 B41M5/00;C09J5/00 主分类号 B41M5/00
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