发明名称 Multi-Layer Finite Element Method for Modeling of Package Power and Ground Planes
摘要 In a method for simulating electrical characteristics of a plurality of power planes, each power plane includes a plurality of geometric features. The geometric features of each power plane are projected onto a single planar construct. A polygonal mesh, including a plurality of pairs of interconnected nodes, that corresponds to the single planar construct is generated. The polygonal mesh is projected onto at least one power plane an equivalent circuit between each adjacent node of the plurality of interconnected nodes is projected onto the power plane. An equivalent capacitance is assigned between each node and a common ground planer. A finite element equation that includes a plurality of discrete terms is generated. The equation is solved, thereby determining the electrical characteristic value between each pair of adjacent nodes.
申请公布号 US2010217576(A1) 申请公布日期 2010.08.26
申请号 US20100710991 申请日期 2010.02.23
申请人 GEORGIA TECH RESEARCH CORPORATION 发明人 BHARATH KRISHNA;SWAMINATHAN MADHAVAN
分类号 G06F17/50 主分类号 G06F17/50
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