发明名称 PHASE CHANGE MEMORY DEVICE AND FABRICATION THEREOF
摘要 A method for forming a phase change memory device is disclosed. A substrate with a bottom electrode thereon is provided. A heating electrode and a dielectric layer are formed on the bottom electrode, wherein the heating electrode is surrounded by the dielectric layer. The heating electrode is etched to form recess in the dielectric layer. A phase change material is deposited on the dielectric layer, filling into the recess. The phase change material is polished to remove a portion of the phase change material exceeding the surface of the dielectric layer and a phase change layer is formed confined in the recess of the dielectric layer. A top electrode is formed on the phase change layer and the dielectric layer.
申请公布号 US2010213432(A1) 申请公布日期 2010.08.26
申请号 US20090468699 申请日期 2009.05.19
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE;POWERCHIP SEMICONDUCTOR CORP.;NANYA TECHNOLOGY CORPORATION;PROMOS TECHNOLOGIES INC.;WINBOND ELECTRONICS CORP. 发明人 CHUANG JEN-CHI;HUANG MING-JENG;LEE CHIEN-MIN;LIN JIA-YO;WANG MIN-CHIH
分类号 H01L45/00;H01L27/24 主分类号 H01L45/00
代理机构 代理人
主权项
地址