| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device. <P>SOLUTION: The semiconductor device includes: a package substrate 3 having a dry resist film 3f partially covering a plurality of conductor portions formed on a principal surface 3a and a back surface 3b and made of a film; a semiconductor chip 1 mounted on the package substrate 3; a conductive wire 4 for electrically connecting the semiconductor chip 1 and package substrate 3 to each other; a film 2 for die bonding, arranged between the principal surface 3a of the package substrate 3 and the semiconductor chip 1; a plurality of solder bumps 8 provided on the back surface 3b of the package substrate 3; and a sealing body 6 made of a resin. Thus, the dry resist film 3f made of the film is provided on the principal surface 3a and back surface 3b of the package substrate 3, which in turn is therefore prevented from curving to prevent package cracking during reflow mounting, thereby improving the reliability of a CSP 7. <P>COPYRIGHT: (C)2010,JPO&INPIT |
