| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for forming planar jet wave of soldering which hardly generates solder oxide and solder balls even when the opening area of a jetting unit is brought close to the opening area of a solder bath and consequently materializes high quality soldering by suppressing initial cost and running cost. SOLUTION: The apparatus includes the solder bath 1 and a box-shaped jetting unit 3 having in the upper part an opening through which fused solder 2 in the solder bath 1 is jetted as a planar jet wave and made to flow back into the solder bath 1. In the jetting unit 3, there are installed rod-like members 8 as volume adjusting members, between the fused solder level formed in the jetting unit 3 with a pump 4 stopped and the opening end face formed by the opening 3a. The rod-like members 8, by obtaining volume so as to reduce a space capacity in the jetting unit 3, maintain within a prescribed limit the decrement of the fused solder level in the solder bath 1, which is produced when the fused solder 2 is jetted from the opening 3a by operating the pump 4. COPYRIGHT: (C)2010,JPO&INPIT |
