发明名称 Heat sink base for LEDS
摘要 An LED assembly can include a heat sink base, at least one LED die attached to the heat sink base, and a lens. One or more layers of phosphor can be formed upon the lens. A heat sink, such as a finned heat sink, can attach the heat sink base to the lens. Heat from the LED die can flow through the heat sink base to the heat sink, from which the heat can be dissipated. Similarly, heat from phosphors can flow through the lens to the heat sink, from which the heat can be dissipated. By removing heat from the LED die, more current can be used to drive the LED die, thus providing brighter light. By removing heat from the phosphors, desired colors can be more reliably provided.
申请公布号 US2010213808(A1) 申请公布日期 2010.08.26
申请号 US20090393559 申请日期 2009.02.26
申请人 SHI WEI 发明人 SHI WEI
分类号 H01J7/24;H01J9/18 主分类号 H01J7/24
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