| 摘要 |
An object of the present invention is to provide a vacuum suction control mechanism apparatus capable of accurately bonding a film to a bonding object with a simple structure. A vacuum suction control mechanism apparatus according to the present invention includes a bonding head including a space defined therein, a plurality of suction holes attracting a film, the plurality of suction holes extending from a surface of the bonding head to the space defined in the bonding head, a movable piece partitioning the space into two regions, the movable piece being movable relative to the bonding head within the space in contact with the suction holes, and a connection portion connectable to a decompression source, the connection portion being provided in a first region of the two regions.
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