| 摘要 |
<p>A method for bonding an LED assembly 71 or other electronic package 31 to a substrate PCB containing a heat-sink 52, which utilizes layers of reactive multilayer foil 51 disposed between contacts 32, 34 of the electronic package 31 and the associated contact pads 55 on the supporting substrate PCB. By initiating an exothermic reaction in the reactive multilayer foil 51, together with an application of pressure, sufficient heat is generated between the contacts 32, 34 and the associated contact pads 55 to melt adjacent bonding material 54 to obtain good electrically and thermally conductive bonds between the contacts 32, 34 and contact pads 55 without thermally damaging the electronic package 31, heat-sensitive components 35 associated with the electronic package 31, or other the supporting substrate PCB.</p> |
