PACKAGE INCLUDING PROXIMATELY-POSITIONED LEAD FRAME
摘要
Embodiments of a microelectronic package are generally described herein. A microelectronic package may include a die having a first side and a second side, opposite the first side, a flange coupled to the first side of the die, and a lead frame proximately positioned relative to the die and coupled to the second side of the die. Other embodiments may be described and claimed.
申请公布号
WO2010057041(A3)
申请公布日期
2010.08.26
申请号
WO2009US64462
申请日期
2009.11.13
申请人
TRIQUINT SEMICONDUCTOR, INC.;BARTLOW, HOWARD, D.;MCCALPIN, WILLIAM, H.;LINCOLN, MICHAEL, G.
发明人
BARTLOW, HOWARD, D.;MCCALPIN, WILLIAM, H.;LINCOLN, MICHAEL, G.