Lighting device manufacturing method, involves placing LED chips adjacent to each other on upper side of connection carrier, and structuring film between or on radiation exit surfaces after placing film on radiation exit surfaces

摘要

The method involves providing a connection carrier (1) i.e. printed circuit board. LED chips (2) are placed adjacent to each other on an upper side (1a) of the carrier, where each chip includes a radiation exit surface (2a) that is turned away from the carrier. A film (3) is placed on the radiation exit surfaces of the respective chips. The film is structured between or on the radiation exit surfaces after placing the film on the radiation exit surfaces. Color or light scattering effect of the film in an irradiated area (5) is changed by irradiating the film with electromagnetic radiation. An independent claim is also included for a lighting device comprising a connection carrier.