METHOD OF MANUFACTURING PACKAGE, METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO CONTROLLED CLOCK

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a package, capable of grinding a metal member projected from a base substrate, without causing cracks and/or chips in the base substrate.

SOLUTION: The method is provided for manufacturing the package having a sealed piezoelectric vibration piece and a through electrode installed at a base substrate for connecting the piezoelectric vibration piece to an external electrode electrically. The method includes the steps of: inserting a core material 31 of a conductive studs 37 into a pierced holes 21 and 22 formed at a wafer 41 for the base substrates, and abutting a plate-like base 36 to the wafer 41 for the base substrates, wherein the conductive studs 37 includes the plate-like base 36 and the core material 31 erected on the surface of the base 36; filling up the pierced holes 21 and 22 with a glass frit 32a; calcinating the glass frit 32a for hardening; and, grindings and removing the base 36 of the studs to expose the core material 31. The step of grinding the base 36 is performed by an one side grinding device, where the flat lower lapping plate grinds the base 36 while the upper lapping plate holds the wafer 41 for the base substrates integrated with the studs 37.

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