发明名称 Soldermask-less printed wiring board
摘要 A printed wiring board has a non-conducting substrate with first and second major outboard surfaces; printed electrical conductors over at least the first major outboard surface; and an electrically insulating coating selectively disposed an over the printed electrical conductors such that the coating forms an outermost layer over the first major outboard surface. In various embodiments, the coating is screen printed dielectric carbon ink which is also disposed over keypads on the second major outboard surface. There is no need for a soldermask layer as the keypads and electrical conductors are protected by the carbon ink from oxidation due to humidity and from shorting against other components. A method for making the PWB is also detailed.
申请公布号 US2010212940(A1) 申请公布日期 2010.08.26
申请号 US20090380091 申请日期 2009.02.23
申请人 NOKIA CORPORATION 发明人 KAUPPINEN ESA H.
分类号 H05K1/02;H05K1/09;H05K3/00 主分类号 H05K1/02
代理机构 代理人
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