发明名称 MANUFACTURING METHOD FOR MICROELECTRONIC MECHANICAL SYSTEM (MEMS) ELEMENT AND MICROELECTRONIC MECHANICAL SYSTEM (MEMS) ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a microelectronic mechanical system (MEMS) element provided with a mirror array using a wall electrode easily. Ž<P>SOLUTION: In this manufacturing method for the MEMS element, a groove part 113a is formed in a first electrode pattern 113, and a groove part is also formed in a second electrode pattern (not shown) in the same way. For example, etching can be performed by using SF<SB>6</SB>as etching gas by the DRIE etching technology being the well-known Si deep-digging processing technology. Here, in the etching forming the groove part 113, etching time is controlled to leave the first electrode pattern 113 (a silicon layer 103) in a bottom part of the formed groove part 113a. For example, etching rate is measured in advance by an experiment, processing time is calculated to leave the first electrode pattern 113 (the silicon layer 103) in the bottom part of the groove part 113a, and the result of calculation is applied to the etching. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010185931(A) 申请公布日期 2010.08.26
申请号 JP20090028386 申请日期 2009.02.10
申请人 NIPPON TELEGR & TELEPH CORP 发明人 UCHIYAMA SHINGO;USUI MITSUO;HASHIMOTO ETSU
分类号 G02B26/08;B81B3/00;B81C1/00 主分类号 G02B26/08
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