| 摘要 |
A quad flat non-leaded chip package structure includes a leadframe, a control chip, a light-sensing chip, a first bonding wire, a plurality of second bonding wires, and a molding compound. The leadframe includes a plurality of leads. Besides, the leadframe has an upper surface and a lower surface opposite to the upper surface. The control chip and the light-sensing chip are disposed on the upper surface of the leadframe. The light-sensing chip is electrically connected to the control chip through the first bonding wire. The control chip is electrically connected to the leads through the second bonding wires. The molding compound encapsulates a portion of the leadframe, the control chip, the light-sensing chip, the first bonding wire, and the second bonding wires. In addition, the molding compound fills among the leads.
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