| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus for forming a coating film on the surface of substrate to be processed and modifying the surface layer of the coating film, which can suppress the increase in the cost and footprint associated with the apparatus and secure sufficient process margin and through-put. Ž<P>SOLUTION: A substrate processing apparatus 100 for forming a coating film R on the surface of substrate G to be processed and modifying the surface layer of the coating film is equipped with a coating means 1 for supplying coating liquid to the surface of substrate G to be processed to form the coating film, a drying means 2 for conducting predetermined drying process on the coating film formed on the substrate by the coating means, and a modifying means 4 for modifying the surface layer of the coating film on which the drying process is conducted by the drying means. The modifying means has a chamber 36 where at least a gas feed port 42 is provided. With the predetermined concentration, solvent atmosphere is introduced into the chamber via the gas feed port under the condition that the substrate is placed in the chamber so that the coating film is exposed to the solvent atmosphere. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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