发明名称 HEAT DISSIPATING DEVICE FOR LED LAMP
摘要 The present invention is a new LED heat dissipating device for improving heat dissipation efficiency in an LED lamp wherein plural LED elements are installed at regular intervals, and a heat dissipating member connected to the LED element dissipates heat accumulated inside the lamp to the outside; arbitrarily controls the number of heat dissipating members applied by overabundance of heat dissipation due to lightness of the LED element; and lengthens the service life by preventing thermal deterioration. The present invention comprises: a printed circuit board having a fixed circuit pattern on a surface and plural heat dissipation holes formed on a longitudinal, central line at regular intervals; plural LED elements inserted and coupled to the heat dissipation holes and electrically connected to the circuit pattern, and powered by applied current; a first heat dissipating member positioned on the vertical upper part of the printed circuit and made of highly thermally conductive materials, wherein a hole is formed along the longitudinal direction of the surface on a position corresponding to each heat dissipation hole on the printed circuit board, plural heat dissipation fins vertically project from both left and right ends at regular intervals, and a cover mounting groove and a lamp cover mounting groove are formed along the longitudinal direction on left / right sides of upper and lower surfaces; plural coupling members made of highly thermal conductive materials, and inserted / coupled from the upper part through each hole formed on the first heat dissipating member, wherein the lower end of the lowest coupling member contacts the upper end of the LED element; plural second heat dissipating members made of highly thermal conductive materials successively inserted and coupled at the upper and lower ends of the coupling member, wherein the heat dissipation fins are radially projected along the outer circumference thereof; a cover which is inserted and coupled to the cover mounting groove formed on both the left and right sides of the upper surface of the first heat dissipating member; and a lamp cover made of transparent or semitransparent materials and inserted / coupled into the lamp cover mounting groove formed on both the left and right sides of the lower surface of the first heat dissipating member to transmit and radiate light to the outside when the LED element is powered.
申请公布号 WO2010095782(A1) 申请公布日期 2010.08.26
申请号 WO2009KR02740 申请日期 2009.05.25
申请人 G&H;LEE, KWAN-HO 发明人 LEE, KWAN-HO
分类号 F21V29/00 主分类号 F21V29/00
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