发明名称 LIGHT EMITTING DIODE HAVING IMPROVED SOLDERING STRUCTURE, METHOD FOR ASSEMBLING THE SAME TO BOARD BY SOLDERING, AND LIGHT EMITTING DIODE ASSEMBLY MANUFACTURED BY THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide an LED having an improved soldering structure, a method of assembling the LED to a board, and an LED assembly manufactured by the same. <P>SOLUTION: This LED includes: an LED chip; a pair of leads each having one end electrically connected the LED chip and the other end to be connected to an external power source, having a groove or a hole formed therein; a package body for sealing a part of the lead on the LED chip side; and a transparent lens put on a surface of the package body on the LED chip side, and structured to emit light emitted from the LED chip laterally. This can improve work conditions in performing soldering work with the other end of the lead placed on the solder, saving the amount of a solder material while improving strength after the soldering. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010187021(A) 申请公布日期 2010.08.26
申请号 JP20100112994 申请日期 2010.05.17
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 HAN KYUNG TAEG;LEE SEON GOO;HAHM HUN JOO;HAN SEONG YEON;SONG CHANG HO;PARK YOUNG SAM
分类号 H01L33/54;H01L33/62;H01L33/56;H01L33/58 主分类号 H01L33/54
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