| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device capable of enhancing a luminous efficiency. <P>SOLUTION: The semiconductor light-emitting device 10 includes: a package 11 including at least a first insulating layer, a second insulating layer, conductive interconnects 14a, 14b formed on a surface of the first insulating layer, and an inner-layer interconnect arranged between the first insulating layer and second insulating layer; a semiconductor light-emitting element 12 placed on the first insulating layer of the package 11; and a sealing member 13 provided on the package 11 so as to cover the semiconductor light-emitting element 12. The inner-layer interconnect is wired while avoiding a region right below an outer peripheral region of the semiconductor light-emitting element 12. <P>COPYRIGHT: (C)2010,JPO&INPIT |
