发明名称 SUBSTRATE INSPECTION APPARATUS AND METHOD OF ALIGNING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate inspection apparatus following a change in the electrical inspection PASS position of a substrate. Ž<P>SOLUTION: The substrate inspection apparatus 1 includes an alignment function for inspecting a wiring pattern 21 of a substrate 2 including substrate positioning marks 201, 202. The substrate inspection apparatus 1 includes: a probe 34; an inspection tool 3 that includes tool positioning marks 311, 312 provided on a probe holding plate 35 and is mounted on the substrate inspection apparatus 1; an inspection tool moving section 162 for moving the inspection tool 3; a press mechanism 166; a substrate holding section 33 for holding the substrate 2; and a control section 11 for recognizing the substrate positioning marks 201, 202 and the tool positioning marks 311, 312 in a pressed state by a camera 15 and for aligning the substrate 2 and the inspection tool 3. The control section 11 statistically calculates the difference between the optical alignment position and a position conforming to an electrical inspection to align and inspect based on the difference. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010185784(A) 申请公布日期 2010.08.26
申请号 JP20090030188 申请日期 2009.02.12
申请人 NIDEC-READ CORP 发明人 NISHIKAWA HIDEO
分类号 G01R31/02;G01R31/28;H05K3/00 主分类号 G01R31/02
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