| 摘要 |
Provided is a copper foil for printed circuit comprising a roughened layer on a surface of a copper foil by way of copper-cobalt-nickel alloy plating, a cobalt-nickel alloy plated layer formed on the roughened layer, and a zinc-nickel alloy plated layer formed on the cobalt-nickel alloy plated layer, wherein the total amount of the zinc-nickel alloy plated layer is 150 to 500μg/dm2, the lower limit of the nickel ratio in the alloy layer is 0.16, the upper limit thereof is 0.40, and the nickel content is 50μg/dm2 or more. With the development of electronic equipment, the miniaturization and high integration of semiconductor devices have advanced further. This tendency has led to a demand for the adoption of a higher temperature in treatment in a production process of printed circuits and has led to heat generation during the use of electronic equipment after the productization. The present invention provides a technique that, even under these circumstances, the adhesive strength between a copper foil and a resin base material does not decrease and the penetration into a circuit edge part can be effectively prevented when performing the soft etching of a copper foil circuit.
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