发明名称 Heat-sinking memory module device
摘要 A memory module has a good heat sinking effect. Each chip on the memory module has a surface exposed in the air. Or, a thermal pad can further adhere to the surface of the chips. Thus, the heat sinking effect of the memory module is improved; and an easy and convenient producing method is obtained.
申请公布号 US2010214742(A1) 申请公布日期 2010.08.26
申请号 US20080149769 申请日期 2008.05.07
申请人 BRIDGE SEMICONDUCTOR CORPORATION 发明人 LIN CHARLES W.C.;PAN WEI-KUANG;WANG CHIA-CHUNG
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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