发明名称 |
Heat-sinking memory module device |
摘要 |
A memory module has a good heat sinking effect. Each chip on the memory module has a surface exposed in the air. Or, a thermal pad can further adhere to the surface of the chips. Thus, the heat sinking effect of the memory module is improved; and an easy and convenient producing method is obtained.
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申请公布号 |
US2010214742(A1) |
申请公布日期 |
2010.08.26 |
申请号 |
US20080149769 |
申请日期 |
2008.05.07 |
申请人 |
BRIDGE SEMICONDUCTOR CORPORATION |
发明人 |
LIN CHARLES W.C.;PAN WEI-KUANG;WANG CHIA-CHUNG |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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