SYSTEM IN PACKAGE BATCH TEST METHOD AND BATCH TEST SYSTEM THEREOF

摘要

A system in package (SIP) batch test method and an SIP batch test system are applicable to an unpartitioned circuit module having a plurality of devices under test (DUTs). The circuit module is loaded in a loading module of the batch test system after probing test and molding operations. A test module of the batch test system is electrically coupled to at least two DUTs. At least two testers provide two different signal tests. A signal transmission controller controls signal transmission paths between the testers and the test module. A test controller controls the two testers and the test module to test the electrically coupled DUTs in parallel and record test results of the DUTs in configuration data. Finally, the circuit module is partitioned, so as to classify the DUTs according to the test results.