INTEGRATED CIRCUIT MICRO-MODULE

摘要

In one aspect, an integrated circuit package composed of a plurality of immediately adjacent stacked layers of cured, planarizing, photo-imageable dielectric is described. At least one interconnect layer is provided between a pair of adjacent dielectric layers. An integrated circuit is positioned within one or more of the dielectric layers such that at least one of the dielectric layers extends over the active surface of the integrated circuit. The integrated circuit is electrically coupled with I/O pads on a surface of the package at least in part through the interconnect layer. In particular embodiments, the package can include thermal pipes, a heat sink, multiple integrated circuits, one or more dielectric layers, sensors, optical elements, passive devices and/or a substrate with embedded components. Various methods for forming the aforementioned packages are also described.