THERMOELECTRIC DEVICE

摘要

The invention relates to a thermoelectric device (1), at least comprising - at least one module (2) with a first carrier layer (3) and a second carrier layer (4); - an interspace (5) between the first carrier layer (3) and the second carrier layer (4); - an electric insulation layer (6) on the first carrier layer (3) and on the second carrier layer (4) towards the interspace (5); - a plurality of p- and n-doped semiconductor elements (7) which are alternately arranged in the interspace (5) between the insulation layers (6) and are alternately connected to each other in an electric manner.