SEMICONDUCTOR DEVICE, BASIC CELL AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

A semiconductor device provided with an interconnect (1) comprising a bent part (2), a first interconnect region (1a) extending from the bent part (2) to the X-direction, and a second interconnect region (1b) extending from the bent part (2) to the Y-direction.  A via (3) is formed under the interconnect (1).  The via (3) is formed at the first interconnect region (1a) so as to not overlap with the region of the bent part (2).  The length (x) of the via (3) in the X-direction is longer than the length (y) in the Y-direction, and the two ends of the same in the Y-direction overlap with the two ends of the first interconnect region (1a) in the Y-direction.