LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: The light-emitting diode package and manufacturing method thereof improve the zygosity of the molding unit and plate. The product reliability is improved. CONSTITUTION: The plate(10) comprises the penetration hole. The light emitting diode chip(20) is settled in the single-side of the plate. The molding unit(40) is formed in the single-side of the plate. The molding unit fills in the light emitting diode chip. The connection part(50) is included to the same material as the molding unit. It is buried to the penetration hole and the connection part is connected to the molding unit.