发明名称 METHOD OF MANUFACTURING ELECTRIC CIRCUIT SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing an electric circuit substrate, in which a connector can be precisely positioned. SOLUTION: The method of manufacturing the electric circuit substrate includes the steps of: preparing the substrate having a plurality of pads provided on an upper surface, and the connector having a body and a plurality of leads provided on a rear surface of the body; arranging the connector on the upper surface of the substrate, so that the plurality of leads are arranged on the plurality of corresponding pads with bonding materials interposed; and bonding the plurality of leads to the plurality of corresponding pads by heating and fusing the bonding materials. In the step of bonding them, the connector is positioned at a target position by making a connector-side positioning part abut on a substrate-side positioning part through self-alignment effect. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010186777(A) 申请公布日期 2010.08.26
申请号 JP20090028280 申请日期 2009.02.10
申请人 MITSUBISHI ELECTRIC CORP 发明人 KONDO TERUHIRO;HIDAKA EIJI
分类号 H05K1/18;H05K3/32 主分类号 H05K1/18
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