发明名称 MICROPHONE UNIT
摘要 PROBLEM TO BE SOLVED: To provide a thin microphone unit of high-sensitivity and high-performance, the microphone unit effectively suppressing stress strain to diaphragms. SOLUTION: The microphone unit includes: a film substrate 11; conductive layers 15, 16 formed on both substrate surfaces of the film substrate 11; and an electroacoustic transduction section 12 including the diaphragm for transducing a sound pressure to an electronic signal. A coefficient of linear expansion of the film substrate 11 including the conductive layers 15, 16 ranges from a value not less than 0.8 to not more than 2.5 times larger than the coefficient of linear expansion of the diaphragm. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010187324(A) 申请公布日期 2010.08.26
申请号 JP20090031614 申请日期 2009.02.13
申请人 FUNAI ELECTRIC CO LTD 发明人 INOTA TAKESHI;HORIBE RYUSUKE;TANAKA FUMINORI;ISHIDA TOMIAKI
分类号 H04R1/02;H04R19/04 主分类号 H04R1/02
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