发明名称 Method to reduce heating at implantable medical devices including neuroprosthetic devices
摘要 A method to control tissue/device heating at implantable medical devices including neuroprosthetic devices. In a first embodiment, thermal conductivity of components of the implantable medical devices including the neuroprosthetic devices is increased. In a second embodiment, the implantable medical devices including the neuroprosthetic devices are cooled by using heat-sinks. In a third embodiment, portions of the implantable medical devices including the neuroprosthetic devices are replaced with specific thermal properties. In a fourth embodiment, the implantable medical devices including the neuroprosthetic devices are coated with a drug/material that will induce surrounding tissue to become more resistant to temperature increases. In a fifth embodiment, the temperature increase near the implantable devices including the neuroprosthetic devices is determined using a modified bio-heat transfer model. In a sixth embodiment, the shape of the outer or the inner surface of the device is modified.
申请公布号 US2010217356(A1) 申请公布日期 2010.08.26
申请号 US20090380021 申请日期 2009.02.21
申请人 BIKSON MAROM;ELWASSIF MAGED M;KONG QINGJUN 发明人 BIKSON MAROM;ELWASSIF MAGED M.;KONG QINGJUN
分类号 A61N1/375 主分类号 A61N1/375
代理机构 代理人
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