发明名称 STAGE DEVICE AND PLASMA TREATMENT APPARATUS
摘要 The present invention provides a stage device which does not generate the difference in level between an upper end of a lift pin and a setting surface of a stage in a state where a substrate to be treated is set on the setting surface of the stage, and provides a plasma treatment apparatus which suppresses the occurrence of uneven treatment by using the stage device as an electrode stage. At the center of an electrode stage (2), a spring type lift pin (20) having elasticity in a direction where the pin moves is provided. When the spring type lift pin (20) is at a storage position, a pin upper end (20a) of the spring type lift pin (20) protrudes above the setting surface (11) of the electrode stage (2). When the substrate (4) to be treated is set and adsorbed on the setting surface (11), the upper end of the lift pin is pressed down to the position that is at the same level as that of the setting surface (11) by a load applied by the substrate (4).
申请公布号 US2010212832(A1) 申请公布日期 2010.08.26
申请号 US20060159387 申请日期 2006.12.22
申请人 SHARP KABUSHIKI KAISHA;SEKISUI CHEMICAL CO., LTD. 发明人 WAKASAKI TAMAKI;SATOH TAKASHI;TANAKA KEIICHI;NAKAJIMA SETSUO;MAYUMI SATOSHI;NAKANO YOSHINORI
分类号 C23F1/08 主分类号 C23F1/08
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