| 摘要 |
PROBLEM TO BE SOLVED: To perform satisfactory plating free from chipping of plating, nonadhesion of plating or the like while suppressing the generation of microorganisms in a pretreatment liquid such as pure water, without frequently exchanging the pretreatment liquid in order to prevent the generation of microorganisms. SOLUTION: The plating equipment is constituted so that the surface of the object to be plated is subjected to pretreatment with a pretreatment liquid, and thereafter, plating is performed, and the equipment includes: a deaeration apparatus 28a deaerating dissolved gas in the treatment liquid; and a microorganism treatment apparatus 30a suppressing the generation of microorganisms in the treatment liquid. COPYRIGHT: (C)2010,JPO&INPIT |
